Lynn, Shane, Ringwood, John and MacGearailt, Niall (2010) Weighted windowed PLS models for virtual metrology of an industrial plasma etch process. In: IEEE International Conference on Industrial Technology (ICIT), March, 2010, Chile.
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Abstract
Virtual metrology is the prediction of metrology
variables using easily accessible process variables and mathematical
models. Because metrology variables in semiconductor
manufacture can be expensive and time consuming to measure,
virtual metrology is beneficial as it reduces cost and throughput
time. This work proposes a virtual metrology scheme that uses
sliding-window models to virtually measure etch rates in an
industrial plasma etch process. The windowed models use partial
least squares (PLS) regression and a sample weighting scheme
to combat the effects of both process drifts due to machine
conditioning and process shifts due to maintenance events. An
industrial data set is examined and the weighted windowed PLS
models outperform global models and non-weighted windowed
models.
Item Type: | Conference or Workshop Item (Paper) |
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Keywords: | Weighted windowed PLS models; virtual metrology; industrial plasma etch process; |
Academic Unit: | Faculty of Science and Engineering > Electronic Engineering |
Item ID: | 3620 |
Depositing User: | Professor John Ringwood |
Date Deposited: | 01 May 2012 14:39 |
Refereed: | Yes |
Related URLs: | |
URI: | https://mu.eprints-hosting.org/id/eprint/3620 |
Use Licence: | This item is available under a Creative Commons Attribution Non Commercial Share Alike Licence (CC BY-NC-SA). Details of this licence are available here |
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