Share and Export
Share and Export
Ragnoli, E., McLoone, Sean F., Lynn, S., Ringwood, John and Macgearailt, N. (2009) Identifying key process characteristics and predicting etch rate from High-Dimension Datasets. Advanced Semiconductor Manufacturing Conference, 2009. . viii-ix. ISSN 1078-8743
![[thumbnail of JR_identifying.pdf]](https://mu.eprints-hosting.org/style/images/fileicons/application_pdf.png "JR_identifying.pdf")
PDF
JR_identifying.pdf
Download (457kB)
Abstract
In semiconductor manufacturing advanced process control (APC) refers to a range of techniques that can be used to improve process capability. As the dimensions of electronic devices have decreased, the application of APC has become more and more important for the critical stages of production processes. However, the economic disadvantage of employing APC is that it requires feedback information in the form of downstream metrology data, which is both time consuming and costly to obtain.
| Item Type: | Article |
|---|---|
| Keywords: | Identifying key process characteristics; predicting etch rate; High-Dimension Datasets; |
| Academic Unit: | Faculty of Science and Engineering > Electronic Engineering |
| Item ID: | 1936 |
| Depositing User: | Professor John Ringwood |
| Date Deposited: | 19 May 2010 13:53 |
| Journal or Publication Title: | Advanced Semiconductor Manufacturing Conference, 2009. |
| Publisher: | IEEE |
| Refereed: | Yes |
| Related URLs: | |
| URI: | https://mu.eprints-hosting.org/id/eprint/1936 |
| Use Licence: | This item is available under a Creative Commons Attribution Non Commercial Share Alike Licence (CC BY-NC-SA). Details of this licence are available here |
Repository Staff Only (login required)
- Item control page
Downloads
Downloads per month over past year
